1. 2. 3. material content data sheet sales product name ipp120n04s3-02 issued 29. august 2013 ma# MA000361814 package pg-to220-3-1 weight* 2040.72 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 12.237 0.60 0.60 5997 5997 leadframe non noble metal iron 7439-89-6 1.407 0.07 689 inorganic material phosphorus 7723-14-0 0.422 0.02 207 non noble metal copper 7440-50-8 1404.801 68.84 68.93 688385 689281 wire non noble metal aluminium 7429-90-5 7.354 0.36 0.36 3604 3604 encapsulation organic material carbon black 1333-86-4 8.778 0.43 4302 plastics epoxy resin - 96.562 4.73 47318 inorganic material silicondioxide 60676-86-0 479.882 23.52 28.68 235154 286774 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10517 10517 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 120 solder noble metal silver 7440-22-4 0.189 0.01 93 non noble metal tin 7440-31-5 0.151 0.01 74 non noble metal lead 7439-92-1 7.225 0.35 0.37 3540 3707 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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